Physical contact layer for body-worn leadware using selective disposition

ABSTRACT

A printed electrical circuit and methods for additively printing electrical circuits. Patterned layers of conductive, insulating, semi-conductive materials, and other materials are print deposited on a flexible or rigid substrate to form electrical circuits. A buffering layer is selectively deposited to cover or encapsulate these materials to comprise a comfort layer that provides a soft and comfortable interface to the skin of a wearer. The comfort layer can be selectively deposited on the same press that the conductive, insulating, semi-conductive materials, and other materials are deposited. Further, the comfort layer is selectively deposited only where it is desired and exactly where it is desired.

REFERENCE TO RELATED APPLICATIONS

The Present Disclosure is a divisional of U.S. patent application Ser.No. 13/804,949, entitled “Physical Contact Layer For Body-Worn LeadwareUsing Selective Deposition” filed on Mar. 14, 2013 which, in turn,claims the benefit of U.S. Provisional Patent Application No. 61/613,067filed Mar. 20, 2012. The content of the aforementioned PatentApplications is incorporated herein in their entireties by reference.

TECHNICAL FIELD

The invention relates generally to flexible electronics, and moreparticularly, to protective layers for printed flexible electronics,such as those used in body-worn leadware.

BACKGROUND

Flexographic, lithographic, gravure, screen printing, digital printingsuch as inkjet or drop on demand, and other processes, including thosein which a central impression cylinder is used, are known in the art forprinting a wide variety of articles. Recently, these and other processesand techniques have been used to print functional materials, includingthose required to make electrical circuits. Whereas etching and othersubtractive processes for creating circuits are wasteful, relativelycostly, and time-consuming, thereby limiting applicability and use,printing processes, by virtue of being additive, can be comparativelyeconomical, efficient in the use of resources, and highly effective inmeeting sufficient product quality standards, i.e., resolution,registration, and other indicators, for many applications. Resultantprinted or otherwise selectively deposited products are therefore moreattractive for a range of applications and industries, and especiallywhere performance standards associated with the more mature slicontechnologies do not necessarily need to be met.

Early circuit boards or base substrates used in the printing ofelectrical circuits, utilized insulating layers made of rigidfiberglass-reinforced resin or ceramic material. However, many printedcircuit boards in use today employ flexible substrates, typically madeof a polyester or polymide material. Not only can conductive traces(wiring) be printed using known methods, but passive components(resistors, capacitors, inducers) and active components (transistorssuch as OFETs, switches, amplifiers, filters, electric batteries,memory, logic devices) are also known in the art. As a result, intricateelectrical circuits that are printed on flexible substrates can compriseprinted flexible electronics.

The aforementioned printed flexible electronics can be used in body-wornleadware. For example, as part of an electrocardiogram (ECG) procedure,a medical professional may attach electrodes to a patient and connectthose electrodes to recording devices using wire leads. Leads oftencomprise individual wires that require considerable management to avoidbecoming entangled in other devices or caught in clothing, bedding, orother equipment. Lead wires can sometimes be arranged or organized intoa “harness” which keeps the wires together and more manageable. However,this lead wire harness can further complicate instances where individualleads need to be broken out to make particular connections to individualsensing points. Alternatively, the interconnection between electrodes ona patient and the recording device can be made using a device in which aconductive path is constructed (often printed) on a thin, flat substratewhich can lie flatter on the patient. Such devices fall into thecategory known as “leadware” and provide effectively a “wearable” set ofECG lead wires to the patient. These body-worn leads can be affixed tothe appropriate locations and electrodes on the patient, where theyremain affixed to the patient and configured to sense ECG data. Thissaves the medical professional from having to constantly manage leadwires. It is also possible that the electrodes can be constructed to beintegral with the leadware. Body-worn leadware is useful in myriad otherapplications, for example, wherever it may be desirable to measurepatient vital signs or other physical characteristics, includingrespiration monitoring, x-rays, C.A.T. scans, fluoroscopy, and so on.Other applications for leadware can include devices forelectro-stimulation for various types of continuous or intermittentdiagnoses or therapies.

However, because body-worn leadware is in contact with the patient'sskin, it can be uncomfortable for the wearer or can cause irritation,chafing, or scratching of the wearer's skin. The substrates, conductivelayers, and dielectric layers that comprise traditional leads containcomponents with various organic or inorganic materials that are designedfor a conductive, insulating, or semi-conductive purpose and are notnecessarily designed to be comfortable to the user. Indeed they have astiffness and sharpness of edge which, just as with paper, can lead tocuts and abrasions. Therefore, body-worn diagnostic or therapeuticdevices typically require some sort of comfort layer to protect the skinof the wearer from the leadware in order to be comfortable.

Some body-worn leads have incorporated protective layers onto theprinted electronically functional layers. Typically, this is achieved bythe lamination of a “comfort layer” made of a woven or non-woven, spunfabric. However, traditional comfort layers suffer from problems inmanufacturing, distribution, and use.

For example, the lamination of a traditional comfort layer typicallyrequires that the comfort layer material first be coated with anadhesive and then laminated to the substrate of the flexible product.This lamination often must be carried out in register so that featuresof the flexible electronics themselves can be aligned with thecorresponding and appropriate cut-outs in the comfort layer material.Thus, the lamination process often requires at least a secondaryprocessing step on at least a secondary piece of equipment. Also, thesecondary piece of equipment must have enough sophistication to supportthe necessary registration of the two layers.

Further, there is often considerable waste of the comfort layer materialbecause the traditional comfort layer manufacturing process typicallystarts with a whole web or sheet (100% coverage) of material which isdie cut before lamination, and then die cut along with the final printedcircuit when the assembly is singulated. This is done because thevarious intricately-aligned features of the printed electronics can bedifficult to align with the corresponding features in a pre-cut piece ofcomfort layer material. The fraction of comfort layer material used inthe final printed circuit product is far less than 100%. Therefore, notonly are additional steps incurred, thus increasing production cost, butcomfort layer material is applied, then cut away and discarded duringproduction, thus further increasing material costs.

Additionally, the packaging of traditional printed flexible electronicsincorporating a comfort layer is problematic. For use with adultpatients, leadware can exceed a length of 36″ long. In order to containthe leadware in packaging for distribution, typically, the product isfolded over a stiffener or rolled on a spool. The rolled or folded unitand holder card or spool are then placed in a container for shipping.The conventional structure of leadware that includes a comfort layerwith adhesive is such that a memory is formed, within the structure, offolds, creases, or rolls as the adhesive layer accommodates the stressesassociated with any bending. As a result, bending during the packagingimpresses a “kink” which the part retains throughout its useful life.For example, referring to FIG. 1A of the prior art, a flexible printedelectronic part 10 of the prior art having a traditional comfort layer12 is depicted after being unpackaged. Memory folds 14 are present inthe part 10 where it was folded over its packaging insert card, evenafter unpacking. These memory folds can be problematic during use of theleadware. It can make the leads difficult to affix (and remain affixed)to the patient. Memory folds can also lead to more interference betweenthe leadware and items in the vicinity such as clothing, bedding, etc.Likewise, there may be interference with the measurement of thepatient's clinical information.

Therefore, there is a need for a comfort layer that can be prepared onflexible substrates and specifically, flexible printed electronics, thatis easily, economically, and efficiently produced, that further does notsuffer from memory fold retention problems of the prior art and can thusbe easily packaged and used. Embodiments having such a comfort layerwill allow more variety in packaging options, thereby adding value toits use.

SUMMARY

Embodiments of the present application substantially meet theaforementioned needs of the industry. In embodiments, patterned layersof conductive, insulating, semi-conductive materials, and othermaterials are deposited on a flexible substrate to form electricalcircuits. A physical buffering layer is deposited on top of thesematerials to form a comfort layer. The construction is such that thecomfort layer, regardless of its order in manufacturing is the layerwhich is closest to the patient or wearer when the device is deployed.The electrical circuits or circuitry so formed of single or multipleprinted or otherwise additively deposited layers can comprise or composetransistor devices, including organic thin film transistors (OTFTs orOFETs), multiple transistor circuits or assemblies, or other electricaldevices, for example batteries, sensors, displays, memory arrays,antennas, and the like. The comfort layer can be configured to cover orencapsulate some or all of these devices as needed to provide a soft andcomfortable interface to the skin.

In embodiments, a comfort layer can comprise ink having a soft, opentexture similar to that of woven or unwoven fabrics. In embodiments, thecomfort layer can comprise an expanding plasticised or “puff ink” thatcan stand alone or comprise an additive to plastisol inks. In anembodiment, plastisol puff inks can comprise suspended PVC particles ina plasticizer, such as an ester, and a puff additive. The plastisol puffink that flows as a liquid or ink for purposes of deposition, andexpands upon curing or the application of heat. In certain embodiments,the plasticizer is an ester of polycarboxylic acid with linear orbranched aliphatic alcohols of moderate chain length. In a particularembodiment, the plasticizer comprises a phthalate ester ofstraight-chain or branched-chain alkyl alcohol.

In embodiments, plastisol puff inks sit atop the substrate and patternedlayers of conductive, insulating, and semi-conductive materials but donot soak into them, instead covering or encapsulating the patternedlayer materials. In other embodiments, the comfort layer can comprisesilicone, urethane, cellulosic, fibrous or other soft and non-abrasivematerials selectively deposited.

In a feature and advantage of embodiments of the invention, a puff inkcomfort layer can be processed in-line with other steps of selectivedeposition of materials during production. When compared to comfortlayer production of the prior art, multiple process steps are saved.First, the removal of the substrate from the system, such as a printingpress, which is used to achieve the selective deposition of the layersother than the comfort layer, is no longer required. The comfort layercan be selectively deposited on the same press that the conductive,insulating, semi-conductive materials, and other materials aredeposited. Second, no adhesive layer is required to first be coated tothe comfort layer material or to the underlying layers prior to theplacement or deposition of the comfort layer on the substrate andconductive, insulating, and semi-conductive components. Third, nointricate cuts of the comfort layer material prior to installation onthe substrate or in concurrence with the final printed circuit cut arerequired and thus no tight registration of the comfort layer to theunderlying pieces is required. Therefore, manufacturing time is savedcompared to comfort layer production of the prior art.

In another feature and advantage of embodiments of the invention, a puffink comfort layer is selectively deposited only where it is desired andexactly where it is desired, by, for example, printing, spray coating,screen printing or coating, coating through a patterned or otherwisepreviously prepare mask, or other techniques. When compared to comfortlayer production of the prior art, material cost is saved. The wasteincurred in cutting a larger than required sheet of material andscrapping the unused part is avoided. On the contrary, the comfort layeris deposited in the precise amount and in the precise location as isdesired in the final printed flexible electronics, with due allowancefor manufacturing tolerance. Thus, material cost is saved compared tocomfort layer production of the prior art.

In another feature and advantage of embodiments of the invention, a puffink (or other) comfort layer can comprise certain dielectric properties.In embodiments, material and production costs can therefore beadditionally reduced by using the puff ink comfort layer as areplacement for certain traditional dielectric layers, when compared toflexible printed electronics of the prior art. In embodiments, materialcosts are saved due to the dual role of the single comfort layer inembodiments of a particular application of a printed circuit; theseparate dielectric layer materials are no longer required to be printedinto the circuit. Production costs are likewise saved due to the dualrole; the dielectric layer is now superfluous and no longer needs to beprinted into the circuit. In embodiments where a dielectric layer isused with a puff ink comfort layer, embodiments of the puff ink comfortlayer add to the insulation properties of the overall circuit.

In another feature and advantage of embodiments of the invention, a puffink comfort layer comprises a waterproof barrier. In other embodiments,a puff ink comfort layer can be deposited on a heavy waterproofing layerto create a waterproof barrier that is still a soft and comfortableinterface to the skin. As a result, the flexible printed electronics ofembodiments can be used in water-laden environments. For example,embodiments of body-worn leads can be utilized in diagnostic ortherapeutic devices worn in swimming pool testing or scuba divingapplications. Additionally, in dry environments where liquid has achance of contacting the printed electronics, embodiments of theflexible printed electronics are further protected from water damage bythe waterproof barrier provided by embodiments of the comfort layer.

In another feature and advantage of embodiments of the invention, nomemory fold is retained in the electronics after crimping or bending. Asa result, body-worn leads are more easily affixed to a patient, and aremore likely to remain affixed than the body-worn leads of the prior art.Additionally, the underlying electronics are not stressed or damaged byany permanent memory of a fold retained by the comfort layer, andmeasurement characteristics are more likely to be measured accuratelythan the body-worn leads of the prior art.

Because no memory fold exists in embodiments, myriad options forpackaging embodiments of the printed flexible electronics are available.For example, embodiments can be rolled up or folded. As a result, theformatting of the packaging can be made to suit widely accepted andbroadly used packaging, handling, and distribution methods, includingthose traditionally recognized in a medical environment. As a result,packaging and handling costs are reduced as no intermediary card insertis required, compared to packaging in the prior art. And further, thebody-worn leads comprising embodiments of the printed flexibleelectronics allow handing in packaging more familiar and convenient tomedical professionals and other end users.

Embodiments of the present application are not limited to medicalapplications. On the contrary, embodiments can be utilized, for example,in the context of “smart clothes” having electronics embedded within apiece of clothing for novelty or utility, or wearable computers, or anyother application where electronics worn against the body necessitate acomfort layer between the electronic components and the wearer. Forexample, performance monitoring for humans and animals in stressful(combat or emergency) or competitive (sports) situations can also callfor distributed sensing and collection of data. In addition, theexpanded use of personal electronic devices for information andentertainment purposes will benefit from clothing attached leadware mademore convenient with an efficiently generated comfort layer. Moregenerally, the integration of electronic functionality with other usesof textiles, such as hospital gowns, blankets, tents, mattress covers,or pillow covers, for example, all benefit from the use of aneconomically constructed comfort layer to protect the user.

Selective deposition methodologies or techniques utilized in variousembodiments can include, for example, any form of additive printingtechniques including, but not limited to, gravure, waterless offset,direct image waterless offset, dry offset, lithographic, intaglio,embossing, engraving, screen, rotary screen, silkscreen, letterpress,flatbed, digital printing such as ink jetting and drop on demandtechniques, xerographic techniques, flexographic, aerosol, pad, dip-pen,or any other related printing techniques or combinations thereof. Inembodiments, the printing methodology or technique chosen can be basedon the particular substrate, or similarly, the particular electric ordielectric layers desired. In other embodiment, selective depositionmethodologies can comprise, for example, spray coating, screen coating,coating through a patterned or otherwise previously prepare mask, orother techniques.

The above summary of the invention is not intended to describe eachillustrated embodiment or every implementation of the present invention.The figures and the detailed description that follow more particularlyexemplify these embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be more completely understood in consideration of thefollowing detailed description of various embodiments of the inventionin connection with the accompanying drawings, in which:

FIG. 1A depicts a flexible printed electronic part of the prior arthaving a traditional comfort layer wherein the part has retained amemory fold.

FIGS. 1B and 2 depict a section of a web of parts covered in dielectricand partially in a comfort layer, according to an embodiment.

FIG. 3A is a cross-sectional block diagram of flexible printedelectronics having a selectively deposited puff ink comfort layer,according to an embodiment.

FIG. 3B is a cross-sectional block diagram of flexible printedelectronics having a selectively deposited puff ink comfort layer,according to an embodiment.

FIG. 3C is a cross-sectional block diagram of flexible printedelectronics having a selectively deposited puff ink comfort layer,according to an embodiment.

FIG. 4 depicts flexible printed electronics having a selectivelydeposited puff ink comfort layer coupled to a patient, according to anembodiment.

FIG. 5 depicts flexible printed electronics having a selectivelydeposited puff ink comfort layer installed into a piece of clothing,according to an embodiment.

FIG. 6 depicts a method by which a flexible printed electronic having aselectively deposited puff ink comfort layer can be produced, accordingto an embodiment.

While the invention is amenable to various modifications and alternativeforms, specifics thereof have been shown by way of example in thedrawings and will be described in detail. It should be understood,however, that the intention is not to limit the invention to theparticular embodiments described. On the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION

Referring generally to FIGS. 1B, 2 and 3A-3C, a set of flexible printedelectronics 100 according to an embodiment are depicted. The set offlexible printed electronics 100 generally comprise individual circuittraces each having a substrate 102, a conductive layer 104, a dielectriclayer 106, and a comfort layer 108. Of course, any particular embodimentcan comprise greater or fewer layers, as the below-described embodimentsare for illustration purposes only and are in no way limiting.

Substrate 102 comprises the base material onto which the conductive,non-conductive, and comfort components will be printed. Substrate 102can be any suitable substrate in a sheet, roll, web, or similarstructure. In an embodiment, substrate 102 comprises a fabric layer,such as cotton or polyester, woven, or non-woven. In other embodiments,substrate 102 comprises other flexible substrates such as polymer filmsuch as polyethylene terephthalate film (PET), Polyethylene naphthalate(PEN), polyimide foil (PI), polypropylene, polyethylene, polystyrene, orany of a variety of polymer films or combinations thereof. In otherembodiments, substrate 102 comprises flexible foil, film, paper,metalized film, or coatings, laminates, and combinations thereof. Instill other embodiments, substrate 102 can comprise rigid substratessuch as glass, silicon, or epoxy resin. Other suitable substances arealso considered, depending on the application of a particularembodiment, and the properties of a particular substrate 102. Substrate102 can be configured to be cut into the desired final shape prior tothe printing or depositing of other layers, or can comprise a sheet orweb onto which the conductive, non-conductive, and comfort componentsare to be printed for later cutting.

In still other embodiments, a discrete substrate 102 is not included inthe set of flexible printed electronics 100. Instead, in suchembodiments, one of the other layers, such as conductive layer 104 ordielectric layer 106, or another layer formed also through selectivedeposition, acts as the base layer onto which the conductive,non-conductive, and comfort components are be printed.

Conductive layer 104 comprises an electrically functional electronicink, toner, or other coating or material that is deposited or printed onsubstrate 102. In embodiments, electrically functional electronic inksare available from Henkel Corporation or DuPont Inc., for example. Inembodiments, conductive layer 104 can be made of any conductivematerial, such as for example, but not limited to, silver, platinum,palladium, copper, nickel, gold, or aluminum or conductive polymer.Therefore, the leads are configured to enable the flow of electricitythrough conductive layer 104. In other embodiments, there can be morethan one conductive layer 104, effectively isolated from otherconductive layers 104 by one or more insulating dielectric layer 106.Conductive layer 104 can be deposited in any shape or configuration, forexample, straight or rounded, or with any number of sequences of curvesor straight sections, in embodiments.

Dielectric layer 106 comprises an insulating layer that covers orencapsulates the first layer of conductive traces of conductive layer104. In embodiments, dielectric layer 106 can be made of any insulatingor non-conductive material or coating, such as for example, but notlimited to, organic or inorganic insulators such as, for example, vinylor urethane resins and binders such as those provided by HenkelCorporation or DuPont Inc. Therefore, dielectric layer 106 is configuredsuch that electricity does not flow through the material of dielectriclayer 106. Dielectric layer 106 can be deposited similarly to conductivelayer 104, in any shape or configuration, for example, straight orrounded, or with any number of sequences of curves or straight sections,in embodiments.

In embodiments, the aforementioned layers 102, 104, and 106 can createactive and passive electronic devices. Patterned layers therefore cancomprise conductive, semiconductive, and insulating materials printedwith suitably formulated conductive, insulating, or semiconductive ink,fluid, powder, particulate, or other deposition compositions. In otherembodiments, the aforementioned layers 102, 104, and 106 can createorganic thin film transistors (OTFTs). As is known to those skilled inthe art, transistor devices in general comprise source and drain,semiconductor, dielectric, and gate layers. Patterned layers thereforecan comprise conductive, semiconductive, and insulating materialsprinted with suitably formulated conductive, insulating, orsemiconductive ink, fluid, powder, particulate, or other depositioncompositions. In an OTFT, the semiconductor layer can comprise anorganic material, for example a polymer. Transistors and OTFTs can beused to form radio frequency identification (RFID) circuits or “tags,”passive or active “smart labels,” batteries, displays and drivers, andother devices or combinations thereof. In other embodiments, sensors ormonitoring electronics, signal conditioning, or electro-stimulationdevices such as those described above in the medical context arecreated.

Comfort layer 108 comprises a soft, sponge- or fabric-like expandedlayer that covers or encapsulates dielectric layer 106, conductive layer104, if so exposed, and portions of substrate 102, if so exposed. Forexample, referring to FIG. 3A, comfort layer 108 encapsulates dielectriclayer 106. In another example, referring to FIG. 3B, comfort layer 108encapsulates dielectric layer 106, portions of conductive layer 104, andportions of substrate 102. Other variations of encapsulations ofdielectric layer 106, conductive layer 104, and substrate 102 by comfortlayer 108 are also possible. Comfort layer 108 can be depositedsimilarly to conductive layer 104 and dielectric layer 106, in any shapeor configuration, for example, straight or rounded, or with any numberof sequences of curves or straight sections, in embodiments.

Comfort layer 108 can be made of an expanding or puff ink. Inembodiments, a puff additive to plastisol inks creates a plastisol puffink that flows as a liquid but sets like a plastic, yet retains a softsponge- or fabric-like compliant texture because it expands rapidly uponcuring or because of the nature of the material. In embodiments, thesoft sponge- or fabric-like, compliant and resilient texture of comfortlayer 108 provides a soothing or comfortable interface to the skin of awearer, when set of flexible printed electronics 100 is positionedproximate a wearer's skin or body. A raised or elevated effect of thepuff ink comfort layer 108 creates additional comfort properties besidesits soft, sponge-like texture. When positioned against the skin, comfortlayer 108 thus provides additional spacing from any attached,complementary electronics or inadvertently exposed layers of substrate102, conductive layer 104, or dielectric layer 106.

The layers 102, 104, 106, and 108 can comprise any dimension or sizesuitable for the particular embodiment or application. The possibleshapes and configurations are limitless. Further, multiple layers ofconductive layer 104, dielectric layer 106, and comfort layer 108 can bedeposited or printed, in embodiments. In an alternative embodiment, oneor more layers 104 or 106 are printed adjacent to, or in the same planeas, or side-by-side comfort layer 108. For example, if comfort layer 108has insulative properties, in an embodiment, conductive layer 104 can beprinted on substrate 102, and comfort layer 108 is printed alongsideconductive layer 104 on substrate 102 and optionally over conductivelayer 104. Upon curing, comfort layer 108 expands to encapsulate andinsulate at least a portion of conductive layer 104.

Referring specifically to FIG. 3C, comfort layer 108 can be selectivelydeposited on dielectric layer 106 and conductive layer 104 so as toexpose conductive layer 104. In embodiments, conductive layer 104 can bein electrical communication with other conductive elements where leftexposed. For example, sensors or monitoring electronics, signalconditioning, electro-stimulation devices, or displays, as describedabove, can be electrically coupled to conductive layer 104 whereexposed.

In operation, referring to FIG. 4, a set of flexible printed electronics100 having a comfort layer 108 of puff ink can be attached to a patient.For example, in an ECG procedure, the set of flexible printedelectronics 100 comprising a circuit made of substrate 102, conductivelayer 104, and dielectric layer 106 is configured as body-worn leadwareto measure patient body characteristics. A medical professional removesset 100 from its packaging, and positions set 100 with comfort layer 108against the patient's skin. In embodiments, as desired, set 100 can beaffixed or operably coupled to the patient such that the electrodesthemselves are coupled to the patient, wherein the leadware hangs fromthe coupled electrodes. Other attachment or coupling schemes are alsoconsidered, such as by adhesive, applied pressure, or any other suitabledevice or method. Subsequently, an electrical current can be appliedthrough set 100, and specifically, conductive layer 104, to electricallyactivate and operate set 100 as it is designed. Dielectric layer 106provides proper insulation to conductive layer 104 to allow current topass or not pass as appropriate. Because of the buffer of comfort layer108 positioned between the skin of the patient and the conductive orinsulating components of set 100, the patient remains comfortablyattached to set 100.

Referring to FIG. 5, a set of flexible printed electronics having a puffink comfort layer is configured within a piece of clothing 200,according to an embodiment. As shown, the clothing 200 is depicted as aT-shirt. However, embodiments are not limited to shirts, and may includepants, hats, shoes, gloves, or any other wearable item of clothing.

Clothing 200, as shown with a front section in cutout, includes aprinted flexible circuit 201 placed along the back of the shirt. Similarto the printed flexible circuit described in previous embodiments,printed flexible circuit 201 includes a substrate 202, a conductivelayer 204, a dielectric layer 206, and a comfort layer 208. As shownwith the front section of clothing 200 cut away, the circuit ispositioned such that comfort layer 208 interfaces with the skin of thewearer—specifically, the wearer's back. For ease of illustration,printed flexible circuit 201 is also shown with conductive layer 204 anddielectric layer 206 exposed beneath comfort layer 208. In embodiments,conductive layer 204 and dielectric layer 206 are not exposed to thewearer's skin.

The fabric of clothing 200 therefore provides substrate 202. Printedflexible circuit 201 can be incorporated into clothing 200 as a stepintermediate the production of the shirt itself, or subsequent to theproduction of the shirt. In another embodiment, printed flexible circuit201 is coupled to the fabric of clothing 200 via Velcro, sewn into thefabric, or otherwise subsequently attached. In such embodiments,substrate 202 comprises a base material onto which the conductive,non-conductive, and comfort components will be printed as in substrate102. Substrate 202 can be any suitable substrate in a sheet, roll, web,or similar structure. In an embodiment, substrate 202 comprises a fabriclayer, such as cotton or polyester, woven, or non-woven. In otherembodiments, substrate 202 comprises other flexible substrates such aspolymer film such as Polyethylene terephthalate-film (PET), Polyethylenenaphthalate (PEN), polyimide foil (PI), polypropylene, polyethylene,polystyrene, or any of a variety of polymer films or combinationsthereof. In other embodiments, substrate 202 comprises flexible foil,paper, metalized film, or coatings, laminates, and combinations thereof.In still other embodiments, substrate 102 can comprise rigid substratessuch as glass, silicon, or epoxy resin.

Conductive layer 204 is printed or deposited onto substrate 202 at alocation on substrate 202 where the sensor or circuit resulting from theprinting process is useful for a particular purpose. For example, thecircuit can be designed for monitoring nervous system signals,respiratory system signals, or circulatory system signals, for example.In another embodiment, the circuit can be designed for electricalstimulation.

Dielectric layer 206 is printed or deposited onto conductive layer 204such that it covers or encapsulates all or portions of conductive layer204 and, in embodiments, portions of substrate 202.

Comfort layer 208 is printed or deposited onto dielectric layer 206 suchthat it covers or encapsulates the patterned layer materials ofconductive layer 204 and dielectric layer 206, and, in embodiments,portions of substrate 202. In an embodiment, comfort layer 208 comprisesprinted puff ink. Therefore, the printed flexible circuit 201 isbuffered by comfort layer 208 where the wearer's skin contacts printedflexible circuit 201. The soft, sponge-like material that comprisescomfort layer 208 provides an interface that is comfortable compared tothe conductive and dielectric layers 204 and 206 printed beneath.

Additional printed flexible circuits 201 can similarly be incorporatedonto substrate 202. Further, additional components can be operablycoupled to printed flexible circuit(s) 201 in order to conductelectricity therethrough. For example, components can be coupled throughthe sleeve of clothing 200. Clothing 200 therefore provides acomfortable, readily wearable mechanism for incorporating flexibleprinted circuits 201 configured as medical devices. Clothing 200 can bedonned by a patient prior to the running of various diagnostic ortherapeutic tests where a monitor is desired along the patient's back.In another embodiment, a therapeutic electro-stimulation device can beapplied to the patient's back. In other embodiments, the circuitsprovided by printed circuit 201 can be designed for novelty; forexample, an interactive display through substrate 202.

In embodiments, printed flexible circuit 201 can be used in parallelwith conductive threads sewn or woven into clothing 200, or, moreparticularly in embodiments, substrate 202. Conductive threads can beused for anti-static, electromagnetic shielding, data transfer, orheating purposes, or any other purpose inherent in conductiveproperties. In embodiments, conductive threads are configured to carrycurrent for power and signals. Therefore, instead of discrete componentscoupling outside of clothing 200 to provide, for example, power ortransmission conduit, such functionality can be incorporated intoclothing 200 via conductive threads. The external components required tobe coupled to clothing 200 to create a functional or enhanced circuitare therefore reduced, creating a readily wearable and freely movablepiece of clothing.

In an embodiment, a set of flexible printed electronics 100 can bepackaged in a kit for shipping or storage. In embodiments, a kit ispackaged for individual sale. In an embodiment, the set of flexibleprinted electronics 100 is folded over a stiffener or folded over itselfand placed in kit packaging, such as a container or bag. In anotherembodiment, the set of flexible printed electronics 100 is rolled on aspool and placed in kit packaging. Due to the flexible resilient natureof the printed electronics and comfort layer, upon unpackaging orunrolling of the set 100, the set 100 is substantially free from memoryfolds. The packaged kit including set 100 can further include a set ofinstructions regarding application of the printed electronics 100, suchas leadware, to a body, article of clothing, blanket, or the like. Theinstructions can include, for example, a map of a body, such as a humanbody, indicating placement of the printed electronics.

Referring to FIG. 6, a method 300 by which flexible printed electronicshaving a puff ink comfort layer can be produced is depicted, accordingto an embodiment. Beginning at step 302, the method is instantiated.Operationally, at step 302, the desired substrate 102 is positioned on aprinting press system. Further, appropriate materials to createconductive layer 104, dielectric layer 106, and comfort layer 108 areassembled and incorporated into the printing press system, ifappropriate.

At step 304, a conductive layer 104 is printed or deposited ontosubstrate 102, and is subsequently cured as needed depending on thematerial characteristics. Conductive layer 104 is printed such thatcurrent can flow through the circuit created by conductive layer 104 toform an appropriate electronic device, according to the desiredembodiment.

At step 306, a dielectric layer 106 is printed or deposited ontoconductive layer 104, and subsequently cured as needed depending on thematerial characteristics. Dielectric layer 106 is printed such that itcovers or encapsulates all or portions of conductive layer 104 and, inembodiments, portions of substrate 102. In embodiments, portions ofconductive layer 104 are left exposed where it is necessary to leave theconductive traces exposed in order to make electrical interconnectionbetween the leadware and some other component. For example, dielectriclayer 106 is not printed or deposed onto conductive layer 104 whereconductive layer 104 is configured to interface with an electrode orrecording device. In other embodiments, dielectric layer 106 is notprinted, as depicted in FIG. 6, and comprises an optional printing step.In such embodiments, comfort layer 308 comprises certain dielectricproperties and thereby acts in a dual role as both a dielectric layerand comfort layer.

Although a wide variety of inks and other materials can be used inprinting conductive layer 104 and dielectric layer 106, conductive,insulating, or semiconductive patterned layers can be obtained, forexample, by printing with a suitably formulated conductive, insulating,or semiconductive ink composition. Electrically conductive orsemiconductive inks contain conductive or semi-conductive materials,such as conductive or semiconductive polymers or conductive orsemiconductive metals or composites. Conductive materials containingmetallic particles such as gold particles, silver particles, and likemetallic particles, carbon particles, conductive or semiconductivepolymers, composite particles, and like particles, or combinationsthereof, can provide for the flow of electrons or electronic signals.The conductive metals or composites can be fine particulates ornanoparticulates. Intricate patterns can be printed withapplication-specific formulations, using, for example any form ofgravure, flatbed, lithography, screen, rotary screen, digital printing,and like print methods, or combinations thereof.

At step 308, a comfort layer 108 is printed or deposited, and issubsequently cured as needed, onto dielectric layer 106 such that itcovers or encapsulates the patterned layer materials of conductive layer104 and dielectric layer 106, and, in embodiments, portions of substrate102. In embodiments, portions of dielectric layer 106, portions ofconductive layer 104, and/or portions of substrate 102 are left exposedin order to provide electrical contact and connection to, for example,the patient or to electrodes. In embodiments, the viscosity of comfortlayer 108 can be adjusted to interface with particular printing presssystems. For example, it may be useful for comfort layer 108 to have alower viscosity on certain printing press systems in order to facilitateease of printing, but have a higher viscosity on other printing presssystems in order to facilitate ease of printing.

Printing methodologies or techniques utilized within the steps to printconductive layer 104 at step 304, print dielectric layer 106 at step306, and print comfort layer 108 at step 308 can include, for example,any form of gravure, waterless offset, direct image waterless offset,dry offset, lithographic, intaglio, embossing, engraving, screen, rotaryscreen, silkscreen, letterpress, flatbed, digital printing such as inkjetting or drop on demand techniques, xerographic techniques,flexographic, aerosol, pad, dip-pen, or any other related printingtechniques or combinations thereof. Each of the layers are cured upondeposition of each individual layer, and/or in batch form with anappropriate curing system, such as, for example, UV, IR, heat, ebeam, orthe like, as appropriate with the ink or material composition used forthe specific layer. In an embodiment, comfort layer 108 expands uponcuring to encapsulate one or more of the other layers.

At step 310, the method 300 is concluded, except for the singulation ofindividual parts from the web or sheet on which they were printed. Thenewly created set of flexible printed electronics is removed from theprinting press system. In embodiments, the set of flexible printedelectronics can be placed individually or in groups in appropriatepackaging.

Embodiments of circuits can comprise greater or fewer layers ofsubstrate 102, conductive layer 104, dielectric layer 106, otherfunctional layers, and comfort layer 108. As a result, method 300 cancomprise greater or fewer steps, including iterations, of theaforementioned steps of printing or depositing conductive layer 104 ontosubstrate 102, printing or depositing dielectric layer 106 ontoconductive layer 104, and printing or depositing comfort layer 108 ontodielectric layer 106.

In an alternative embodiment (not shown), an electric circuit assemblyis formed in a reverse configuration. For example, a comfort layermaterial is selectively deposited on a first substrate, the substratecomprising a web or sheet having an optional release layer. The comfortlayer is cured so that it expands to form a well-formed comfort layer.The one or more layers of the electronic device, such as the conductiveand dielectric layers, are then deposited directly on the comfort layerand/or a separate second substrate. The second substrate optionallyhaving the conductive layer and dielectric layer thereon is then coupledto, the comfort layer on the first substrate via lamination, fusing, orother methods. The first substrate on which the comfort layer isdeposited on is then removed, such as by peeling, leaving the electriccircuit assembly on the second substrate.

In yet another alternative embodiment (not shown), a comfort layermaterial is selectively deposited on a transfer substrate, the substratecomprising a web or sheet having an optional release layer. The comfortlayer is cured so that it expands to form a well-formed comfort layer.The one or more layers of the electronic device, such as the conductiveand dielectric layers, are then deposited directly on the comfort layer.A second, comfort layer is then selectively deposited on the firstcomfort layer and electronic device. The second comfort layer is curedto encapsulate the electronic device, such that the layers of theelectronic device are sandwiched between the comfort layers. Thesubstrate is then optionally removed, such that the finished assemblyincludes no substrate.

In yet another embodiment, the comfort layer is selectively deposited ona first portion of a substrate, such as a sheet. One or more layers ofan electronic device are then selectively deposited or laminated to asecond portion of the substrate, either directly on the substrate, oralternatively on a second comfort layer selectively deposited and curedon the second portion of the substrate. The substrate is then foldedover to marry the one or more layers deposited on the second portion ofthe substrate to the comfort layer deposited on the first portion of thesubstrate (either cured or uncured). If not already cured, one or morelayers of the assembly are cured such that the comfort layer(s)encapsulate the electronic device layers. At least the first portion ofthe substrate having the comfort layer thereon is removed; and in someembodiments, such as when the second comfort layer is present, theentire substrate is removed.

Various embodiments of systems, devices and methods have been describedherein. These embodiments are given only by way of example and are notintended to limit the scope of the invention. It should be appreciated,moreover, that the various features of the embodiments that have beendescribed may be combined in various ways to produce numerous additionalembodiments. Moreover, while various materials, dimensions, shapes,configurations and locations, etc. have been described for use withdisclosed embodiments, others besides those disclosed may be utilizedwithout exceeding the scope of the invention.

Persons of ordinary skill in the relevant arts will recognize that theinvention may comprise fewer features than illustrated in any individualembodiment described above. The embodiments described herein are notmeant to be an exhaustive presentation of the ways in which the variousfeatures of the invention may be formed or combined. Accordingly, theembodiments are not mutually exclusive combinations of features; rather,the invention may comprise a combination of different individualfeatures selected from different individual embodiments, as understoodby persons of ordinary skill in the art.

Any incorporation by reference of documents above is limited such thatno subject matter is incorporated that is contrary to the explicitdisclosure herein. Any incorporation by reference of documents above isfurther limited such that no claims included in the documents areincorporated by reference herein. Any incorporation by reference ofdocuments above is yet further limited such that any definitionsprovided in the documents are not incorporated by reference hereinunless expressly included herein.

What is claimed is:
 1. A method of printing a flexible electronic, themethod comprising: providing a substrate; depositing at least aconductive material on a first side of the substrate to provideelectronic circuitry; and selectively depositing a comfort layer whichencompasses at least a portion of the electronic circuitry.
 2. Themethod as defined in claim 1, wherein the substrate is not configured tobe separated from the electronic circuitry.
 3. The method as defined inclaim 1, wherein the comfort layer is selectively deposited by printing,spray coating, or through a patterned or prepared mask.
 4. The method asdefined in claim 3, wherein the comfort layer is deposited by a printingtechnique comprising gravure, waterless offset, direct image waterlessoffset, lithographic, intaglio, embossing, engraving, screen, rotaryscreen, silkscreen, letterpress, flatbed, digital printing, ink jet,drop on demand, xerographic, flexographic, aerosol, pad, dip-pen, orcombinations thereof.
 5. The method as defined in claim 1, wherein thecomfort layer comprises a cured ink.
 6. The method as defined in claim5, wherein the cured ink is a plastisol ink having a puff additive. 7.The method as defined in claim 5, wherein the comfort layer is formed ofan electronic ink.
 8. The method as defined in claim 1, wherein thecomfort layer exhibits electrically insulative properties such that thecomfort layer provides electrical isolation for the encapsulatedportions of the circuitry.
 9. The method as defined in claim 1, whereinthe comfort layer provides mechanical protection to the encapsulatedcircuitry.
 10. The method as defined in claim 1, wherein the comfortlayer is waterproof or water resistant such that the comfort layerprotects the encapsulated circuitry from water moisture.
 11. The methodas defined in claim 1, wherein the comfort layer is solvent-proof orsolvent-resistant such that the comfort layer protects the encapsulatedcircuitry from chemical intrusion.
 12. The method as defined in claim 1,wherein the conductive material is formed from a material selected fromthe group consisting of silver, platinum, palladium, copper, nickel,gold, aluminum, or conductive polymer.
 13. The method as defined inclaim 1, further comprising the step of selectively depositing adielectric material between at least a portion of the conductivematerial and the comfort layer, where the selectively depositeddielectric material forms part of the electronic circuitry.
 14. Themethod as defined in claim 13, wherein the dielectric material comprisesa vinyl or urethane resin.
 15. The method as defined in claim 1, whereinthe substrate is flexible, and wherein the substrate, electroniccircuitry and comfort layer are substantially free from memory foldsupon flexure of the substrate.
 16. The method as defined in claim 1,further comprising the step of selectively depositing a second comfortlayer over at least a portion of a second side of the substrate.
 17. Themethod as defined in claim 1, wherein the electronic circuitry isadapted and/or designed for monitoring nervous system signals,respiratory system signals, circulatory system signals, for providingelectrical stimulation, electronic display, or any combination thereof.18. The method as defined in claim 1, wherein the assembly isincorporated into wearable smart clothes, hospital gowns, blankets,sheets, tents, mattress covers, towels, bibs, or pillow covers.
 19. Amethod of printing a flexible electronic configured to be worn on a bodyof a wearer, the method comprising the steps of: providing a conductivelayer which allows for the flow of electricity therethrough; andcovering or encapsulating at least a portion of the conductive layerwith a comfort layer, wherein the comfort layer is a cured ink, andwherein the comfort layer is configured to be positioned against thebody of the wearer.
 20. The method as defined in claim 19, wherein thecured ink is a plastisol ink having a puff additive.
 21. The method asdefined in claim 19, wherein the conductive layer is a base layer of theflexible printed electronic.
 22. The method as defined in claim 19,wherein the conductive layer is formed of an electronic ink.
 23. Themethod as defined in claim 19, further comprising the steps of:providing a base layer; and covering or encapsulating at least a portionof the base layer with the conductive layer.
 24. The method as definedin claim 23, wherein the base layer is fabric.
 25. The method as definedin claim 24, wherein the fabric is provided in a piece of clothing. 26.The method as defined in claim 23, wherein the base layer is asubstrate.
 27. The method as defined in claim 26, wherein the flexibleprinted electronic is configured to be coupled to fabric provided in apiece of clothing.
 28. A method of printing a flexible electronicconfigured to be worn on a body of a wearer, the method comprising thesteps of: providing a conductive layer which allows for the flow ofelectricity therethrough; covering or encapsulating at least a portionof the conductive layer with a dielectric layer; and covering orencapsulating at least a portion of the dielectric layer with a comfortlayer, wherein the comfort layer is a cured ink, and wherein the comfortlayer is configured to be positioned against the body of the wearer. 29.The method as defined in claim 28, wherein the cured ink is a plastisolink having a puff additive.
 30. The method as defined in claim 28,wherein the conductive layer is a base layer of the flexible printedelectronic.
 31. The method as defined in claim 28, wherein theconductive layer is formed of an electronic ink.
 32. The method asdefined in claim 28, further comprising the steps of: providing a baselayer; and covering or encapsulating at least a portion of the baselayer with the conductive layer.
 33. The method as defined in claim 32,wherein the base layer is fabric.
 34. The method as defined in claim 33,wherein the fabric is provided in a piece of clothing.
 35. The method asdefined in claim 32, wherein the base layer is a substrate.
 36. Themethod as defined in claim 35, wherein the flexible printed electronicis configured to be coupled to fabric provided in a piece of clothing.